Article, Investigation of Thermal Transport Phenomena in Micro-scale Heat Sinks: Influence of Geometric Architecture and Advanced Material Selection for Nano-electronic Cooling
Investigation of Thermal Transport Phenomena in Micro-scale Heat Sinks: Influence of Geometric Architecture and Advanced Material Selection for Nano-electronic Cooling
DOI:
https://doi.org/10.65273/hhit.jna.2026.2.2.036Keywords:
Heat sink, shape, material, size, heat transfer, COMSOL MultiphysicsAbstract
This study investigates the hydrothermal performance of semiconductor heat sinks through a steady-state Conjugate Heat Transfer (CHT) model utilizing the Finite Volume Method. By examining thermal boundary layer dynamics at the micro-scale interface, the research evaluates the synergistic effects of geometric architecture and material properties. Numerical results demonstrate that copper (Cu) configurations achieve a 2–5 K reduction in base temperature compared to aluminum and Al–Si alloys under equivalent constraints. Circular fin geometries exhibit a 6–10% enhancement in heat dissipation efficiency over square and triangular designs, attributed to optimized effective contact area and streamlined convective flow. Furthermore, increasing fin thickness significantly improves conductive transport, whereas geometric transitions to non-circular profiles exacerbate thermal resistance. These findings provide a robust computational framework for integrating advanced nanomaterials into high-power density cooling systems, establishing a scientific basis for optimizing next-generation nano-electronic thermal management.
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The data that support the findings of this study are available from the corresponding authors upon reasonable request.
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Copyright (c) 2026 Dung Nguyen Trong, Anh Le Duc, Nguyen Dac Dien, Umut SaraÇ (Author)
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